Why the Open Compute Project Matters for Data Center Cooling—and How TIPCO Technologies and Danfoss Lead the Way

As data centers evolve to meet the demands of high-performance computing, AI workloads, and sustainability goals, the Open Compute Project (OCP) has emerged as a driving force in reshaping how infrastructure is designed, cooled, and maintained. For those sourcing hoses and fittings for data centers, understanding OCP standards is no longer optional—it’s essential.

What Is the Open Compute Project?

Founded by Facebook in 2011, the Open Compute Project is a collaborative initiative that promotes open-source hardware designs for scalable, efficient data centers. OCP’s mission is to reduce complexity, improve energy efficiency, and foster interoperability across vendors. One of its most impactful areas? Advanced Cooling Facilities (ACF)—a set of standards that guide how liquid cooling systems interface with IT hardware.

Why Liquid Cooling Is the Future

Traditional air cooling is struggling to keep up with the heat generated by modern servers and GPUs. That’s why liquid cooling—especially direct-to-chip and rear-door heat exchangers—is gaining traction. But implementing these systems requires precision-engineered hoses, quick disconnects, and fittings that meet OCP’s rigorous standards.

Enter Danfoss: OCP-Compliant Cooling Solutions

As a Danfoss Data Center Preferred Distributor, TIPCO Technologies proudly supplies a full range of Danfoss products engineered for OCP-compliant data centers. Two standout solutions include:

Danfoss Universal Quick Disconnects (UQDs)

Designed for blind-mate connections in high-density environments, Danfoss UQDs offer:

  • Leak-free performance with helium-tested seals
  • Self-aligning design for tool-free maintenance
  • EPDM seals and stainless-steel construction for durability
  • High flow rates with minimal pressure drop

These quick disconnects are ideal for modular liquid cooling loops, enabling fast servicing and scalability in OCP-compliant racks.

Danfoss FD83 Flat Face Couplings

The FD83 series is built for high-performance liquid cooling applications:

  • Flat face design minimizes fluid loss during disconnection
  • Push-to-connect operation simplifies installation
  • Robust sealing for glycol-based coolants and other fluids
  • Compact footprint for tight data center layouts

Whether you're designing a new facility or retrofitting an existing one, the FD83 ensures reliable, efficient fluid transfer in mission-critical environments.

TIPCO Technologies: Your Trusted Partner

TIPCO Technologies is more than a distributor—we’re a strategic partner in your data center journey. As a Danfoss Data Center Preferred Distributor, we offer:

  • Expert guidance on OCP-compliant cooling systems
  • Custom hose assemblies and fittings tailored to your specs
  • Fast turnaround and nationwide support

We understand the unique challenges of data center cooling and are here to help you navigate them with confidence.

Have questions or ready to get started? Email datacooling@tipcotech.com or visit our eStore Liquid Cooling catalog!

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